NEC infrared thermal imager, PCB acceleration sensor, high pixel infrared imager, dynamic data acquisition instrument, woodworking laboratory, PCB sensor, wire rope detector, handheld XRF spectrometer, infrared detection service, wire rope nondestructive testing, wire rope flaw detection service, wire rope lubricator, MIKRON blackbody calibration source, IMPAC infrared thermometer.
- American Piezoelectric PCB Sensor
- Data acquisition instrument
- stress-strain measurement
- infrared thermal imager
- Handheld XRF Spectrometer
- France CA Electrical Measurement
- Woodworking machinery and equipment
- Wire rope detector
- full-day blind ultraviolet imager
- Blackbody calibration source
- Professional Testing Services
- X-ray residual stress tester
- spectrophotometer
Detection of stripping condition of NEC R550D cement bridge
用NEC紅外熱像儀不使用高空作業(yè)車或者搭建腳手架，就可以檢查發(fā)現(xiàn)水泥橋梁的剝離狀況
解決方案?。?/p>
Avio的紅外熱像儀可以實(shí)現(xiàn)上述應(yīng)用，提高點(diǎn)檢的效率
超分辨率功能1280x960像素和廣角(*大93°)的攝影可以實(shí)現(xiàn)更精細(xì)的觀察
應(yīng)用NEC R550紅外熱像儀對(duì)水泥構(gòu)造物的剝離狀況的測(cè)量原理
① 白天、針對(duì)水泥外部施加熱量的話，與健全部位相比較的剝離部位熱容量小、容易更快發(fā)熱。
熱量例：太陽光、晝夜的溫度差等
② 外部施加熱量消失的話，水泥構(gòu)件吸收的熱量會(huì)向外部釋放。與熱容量大的部位相比較剝離部位容量小、溫度下降快。一定時(shí)間后健全部位與剝離部位的溫度差將消失，此時(shí)監(jiān)測(cè)剝離部位就比較困難。
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